| Facilities | Location | Size (sq ft) | Function Focuses | Main Equipment | Note |
|---|---|---|---|---|---|
| US Engineering and Support Center | Austin, TX, USA | 200 | Customer Support and Front-End Engineering | EEPROM programmer, system compatibility testing, engineering development tools, soldering station, computing cluster | Design/Engineering/Tech Support |
| Shenzhen Engineering and Support Center | Yabian Industrial Park, Bao’an Dist., Shenzhen, China | 3,000 | Design engineering, prototyping, validation | VNA, TDR, BERTscopes, LLCR, Bending, X-ray, CCD, Salt-spray, High-temp chamber, Computing clusters | Design/Engineering/Support Center |
| Shenzhen Factory | Yabian Industrial Park, Bao’an Dist., Shenzhen, Guangdong, China | 15,000 | High-speed cable, Active optical cable, PCB modules | High-pressure molding, low pressure molding, hotbar, laser stripping, automated wire processing, CCD, LLCR, VNA, TDR, RF-switches, Auto-testers, laser soldering | Digitized factory with remote factory auditing, on-line process monitoring, data-tracking |
| Meizhou Factory | Xingping Industry Park, Pingyuan, Meizhou, Guangdong, China | 60,000 | USB,Overmolded Harness,High speed cable,Connectors | High-pressure molding, low pressure molding, hotbar, laser stripping, automated wire processing, CCD, LLCR, VNA, TDR, FR-switches, Auto-testers, laser soldering | |
| Vietnam Factory | Work-in-progress | 20,000 | RF cable. antenna assemblies | VNA, Hotbar soldering, LLCR, X-ray, Wire stripping, reliability testing, VNA, TDR | High-speed cable assembly production transfer planned in 2021 |
Moving data to the future, faster
Wandtec, a ColorChip company
